GF and TSMC Reach Agreement to Produce Silicon Intermediate Layer in the U.S.

GlobalFoundries (NASDAQ: GFS) announced on October 8, 2026 that it has reached a manufacturing agreement with TSMC to establish a domestic silicon intermediate layer supply in the United States for TSMC CoWoS ® Advanced packaging ecosystem. According to the agreement, GF will provide manufacturing services to TSMC and increase manufacturing capacity at its Malta factory in New York State to support the growing demand for high-performance computing and AI systems. This agreement lays the foundation for gradually expanding production capacity as customer demand grows.

GF is expected to expand its production capacity at its Malta factory and establish the first domestic source of silicon interlayer in the United States, supporting advanced packaging technologies including embedded deep trench capacitor components. The addition of manufacturing capacity will provide greater scale and flexibility for delivering advanced packaging solutions across multiple generations of products.

Ed Kaste, Senior Vice President of GF CMOS Business, said, “Advanced packaging is increasingly crucial for delivering the performance, energy efficiency, and scale required for next-generation AI systems. By leveraging GF’s trusted US manufacturing footprint to provide manufacturing services, we are creating secure and scalable sources of critical advanced packaging components to help customers accelerate innovation and strengthen their semiconductor supply chains.”

Mass production and shipment are expected to begin in the first half of 2028 at GF Malta factory. The initial term of the agreement is five years and provides a framework for future capacity expansion.

About GF

GlobalFoundries is a leading global semiconductor manufacturer that enables large-scale applications of AI from the cloud to the physical world. Through deep collaboration with clients, GF provides differentiated, energy-efficient, and high-performance solutions for automotive, aerospace and defense, data centers, smart mobile devices, IoT, and other high growth markets.