Corning® Pushlok™ Connector: Engineered for Future High-Density Networks
This article is primarily aimed at data center designers, network architects, and CTOs, exploring how the Pushlok™ connector supports the evolution from 100G/400G to 800G/1.6T and beyond, while addressing the concomitant challenges of high density, thermal management, and infrastructure manageability. Key Points: 1. Foundational for High-Speed Evolution: Emphasizes that its excellent, scalable optical performance (low … Continued