UMC Arranges Silicon Photonics Layout
Semiconductor foundry UMC announced that it has signed a technology licensing agreement with the Belgian Microelectronics Research Center to obtain the imec iSiPP300 silicon photonics process, which is compatible with co packaged optics (CPO). Through this licensing cooperation, UMC will launch a 12 inch silicon photonics platform, targeting the next generation of high-speed connectivity applications.
UMC stated that AI data load is increasing day by day, and traditional copper interconnects are facing bottlenecks. Silicon photonics technology, which uses optical transmission to transmit data, has become a solution for data centers, high-performance computing, and network infrastructure in ultra-high bandwidth, low latency, and high energy efficiency. UMC will combine IMEC’s validated 12 inch silicon photonics process technology with UMC’s SOI wafer process to provide customers with a highly scalable photonic chip (PIC) platform.
Senior Vice General Manager Hong Guijun pointed out that obtaining authorization for imec’s most advanced silicon photonics process technology will accelerate the development process of UMC’s 12 inch silicon photonics platform. UMC is collaborating with multiple new customers and expects to provide photonic chips for optical transceivers on this platform, with risk trials scheduled for 2026 and 2027. In addition, the future system architecture of UMC will move towards higher integration of CPO and optical I/O, providing high bandwidth, low energy consumption, and highly scalable optical interconnect application solutions required within and across data centers.
Philippe Absil, Vice President of IC Link by imec, stated that the iSiPP300 platform features sophisticated and high-performance components, including micro ring modulators and germanium silicon (GeSi) electroabsorbent modulators (EAM), paired with diverse low loss fiber interfaces and 3D packaging modules. The cooperation with UMC will help expand the market for silicon photonics solutions and accelerate the introduction of next-generation computing systems.